AMAOE BGA SOLDERING PASTE

M10-lead medium temperature solder paste 183 °: Suitable for regular mobile phone repair and use, reducing rework. Features: medium temperature 183 °, fine smooth and good sticky, tin plating does not bubble, tin beads are even. M11-lead-free low temperature solder paste 138 °: Suitable for mobile phone repairs that cannot withstand high temperatures (such as the tinning of the middle layer of Phone X motherboard repair), reducing maintenance difficulty and reducing risk. Features: low temperature 138 °, fine smooth and good sticky, tin plating does not bubble, tin beads uniform, reduce maintenance difficulty, reduce risk, but the welding firmness is not medium and high temperature.